Surface-acoustic-wave device having an improved pass-band characteristic and an improved degree of freedom for setting input and output impedances

ABSTRACT

A surface acoustic wave device supported by a package body. At least one surface acoustic wave element having interdigital electrodes disposed on a propagation path of a surface acoustic wave on the piezoelectric substrate. These interdigital electrodes include an input-side interdigital electrode connected to a ground pad on the package body and an output-side interdigital electrode connected to another ground pad on the package body.

This application is a divisional of application Ser. No. 08/760,097,filed Dec. 3, 1996, now U.S. Pat. No. 5,963,114.

BACKGROUND OF THE INVENTION

The present invention generally relates to surface-acoustic-wave (SAW)devices and more particularly to a SAW device having an improvedpassband characteristic. Further, the present invention relates to a SAWdevice that is flexible in design for setting input and outputimpedances of the SAW device as desired.

SAW devices are used extensively for a filter or a resonator in compactradio telecommunication apparatuses operational in a VHF or UHF band, atypical example being a portable telephone apparatus operational in aMHz band or GHz band.

In such high frequency radio telecommunication apparatuses, it isrequired that the SAW filters or SAW resonators used therein have a widepass-band and simultaneously a very sharp off-band attenuation. Further,the SAW filters and resonators should be able to achieve an impedancematching with a cooperating circuit, which may be an integrated circuitforming the electronic apparatus in which the SAW device is used.

FIGS. 1A and 1B show the construction of a typical conventional SAWfilter.

Referring to FIG. 1A, the SAW filter is a device of the so-calleddouble-mode type and includes a pair of reflectors 10A and 10B on apiezoelectric substrate I as usual in a SAW filter, wherein thepiezoelectric substrate may be a Y-X cut single-crystal plate of LiTaO₃or LiNbO₃. Further, electrodes 11A, 11B and 11C are providedconsecutively between the foregoing reflectors 10A and 10B from thereflector 10A to the reflector 10B.

In the illustrated example of FIG. 1A, the substrate 1 is formed of asingle-crystal plate of 36° Y-X LiTaO₃, and the reflectors 10A and 10B,aligned in an X-direction of the substrate 1, define a propagation pathof a surface acoustic wave excited on the piezoelectric substrate 1.Each of the electrodes 11A, 11B and 11C includes a primary-sideinterdigital electrode such as an electrode (11A)₁, (11B)₁ or (11C)₁ anda secondary-side interdigital electrode such as an electrode (11A)₂,(11B)₂ or (11C)₂, wherein the primary-side electrode and thesecondary-side electrode are disposed such that the electrode fingers ofthe primary-side electrode and the electrode fingers of thecorresponding secondary-side electrode extend in respective, mutuallyopposing directions, as usual in an interdigital electrode. Thereby, theelectrode fingers of the primary-side electrode and the electrodefingers of the secondary-side electrode are repeated alternately in theX-direction on the substrate 1 and intersect the path of the surfaceacoustic wave traveling in the X-direction on the substrate 1. The pitchof the electrode fingers is determined by a central frequency of the SAWfilter to be formed as well as by the sound velocity of the surfaceacoustic wave traveling on the substrate 1 in the X-direction. Whenviewed in the X-direction, the electrode fingers of the primary-sideelectrode and the electrode fingers of the secondary-side electrodeoverlap with each other over an overlap width W.

In the construction of FIG. 1A, the primary-side electrode (11A)₁, ofthe electrode 11A is connected to an input terminal commonly with theprimary-side electrode (11C)₁ of the electrode 11C. On the other hand,the secondary-side electrodes (11A)₂ and (11C)₂ are both grounded.Thereby, the SAW filter of FIG. 1A forms a device of the so-called dualinput single-output type.

The double-mode SAW filter of such a construction uses a first-ordermode of surface acoustic wave formed between the foregoing reflectors10A and 10B with a frequency f₁ and a third-order mode of surfaceacoustic wave formed also between the reflectors 10A and 10B with afrequency f₃, wherein the SAW filter forms a pass-band characteristic asindicated in FIG. 2. FIG. 2 shows the attenuation of the SAW filter as afunction of the frequency. In FIG. 2, it should be noted that apass-band is formed between the foregoing frequency f₁ of thefirst-order mode and the frequency f₃ of the third-order mode. FIG. 1Bshows the energy distribution of the surface acoustic wave excited inthe structure of FIG. 1A.

Conventionally, it has been practiced to form the interdigitalelectrodes 11A-11C to be generally symmetric about the center of theX-axis in view of the corresponding symmetricity of the first-order-modeand the third-order mode of the excited surface acoustic waves (see FIG.1B), so that the first order-mode surface acoustic wave and thethird-order-mode surface acoustic wave are excited efficiently. Thus, ithas been practiced conventionally to set a number N₁ indicating thenumber of the electrode finger pairs formed by the primary-sideelectrode fingers and the secondary-side electrode fingers in theinterdigital electrode 11A, to be equal to a number N₃ indicating thenumber of the electrode finger pairs formed by the primary-sideelectrode fingers and the secondary-side electrode fingers in theinterdigital electrode 11C (N₁=N₃).

However, FIG. 2 clearly indicates that various spurious peaks exist inthe SAW device outside the pass-band defined by the frequencies f₁ andf₃. As a result of the existence of such spurious peaks, it should benoted that the sharpness of attenuation of surface acoustic wave outsidethe pass-band is reduced unwantedly, particularly in the frequency rangebetween 1550 MHz and 1600 MHz. It should be noted that the attenuationof a SAW filter or resonator should be flat and minimum inside thepass-band and increase sharply outside the pass-band. In order tomaximize the selectivity of the filter, it is desired to maximize theattenuation outside the passband.

In the conventional SAW filter of FIG. 1A, all of the interdigitalelectrodes 11A, 11B and 11C have the same overlap width W of theelectrode fingers. Thus, the input and the output impedances of the SAWfilter are determined by the number of pairs of the electrode fingers inthe electrodes 11A-11C. Generally, it should be noted that the input andoutput impedances of a SAW filter are inversely proportional to thenumber of the electrode finger pairs N₁ and N₃ and the overlapping W forthe electrodes 11A-11C. As the number N₁ and the number N₃ of theelectrode finger pairs are set equal to each other and the overlap widthW is constant in conventional SAW devices, it has been difficult to setthe input impedance and the output impedance independently and asdesired. Thus, conventional SAW devices have failed to meet the demandfor the capability of flexibly setting the input and output impedances,while such a demand of flexible setting of the input and outputimpedances is particularly acute in recent compact radio apparatuses forGHz applications such as a portable or mobile telephone apparatus.

SUMMARY OF THE INVENTION

Accordingly, it is a general object of the present invention to providea novel and useful SAW device wherein the foregoing problems areeliminated.

Another and more specific object of the present invention is to providea SAW device capable of suppressing spurious peaks effectively outsidethe pass-band and simultaneously providing a sharp attenuation outsidethe pass-band.

Another object of the present invention is to provide a SAW devicecapable of setting an input impedance and an output impedanceindependently and flexibly.

Another object of the present invention is to provide a SAW device,comprising:

a piezoelectric substrate;

at least first and second SAW elements formed commonly on saidpiezoelectric substrate each along a predetermined propagation path of asurface acoustic wave on said piezoelectric substrate;

each of said first and second SAW elements including a plurality ofinterdigital electrodes disposed along said predetermined propagationpath of said surface acoustic wave;

each of said plurality of interdigital electrodes including aprimary-side electrode that in turn includes a plurality of mutuallyparallel electrode fingers extending in a first direction across saidpropagation path and a secondary-side electrode that in turn includes aplurality of mutually parallel electrode fingers extending in a second,opposite direction across said propagation path;

said electrode fingers of said primary-side electrode and said electrodefingers of said secondary-side electrode being disposed, in each of saidinterdigital electrodes in each of said first and second SAW elements,alternately along said propagation path so as to overlap with apredetermined overlap width when viewed in a direction of saidpropagating path;

said overlap width having a first value commonly in said plurality ofinterdigital electrodes forming said first SAW element and a second,different value commonly in said plurality of interdigital electrodesforming said second SAW element;

said first SAW element being cascaded to said second SAW element byconnecting a secondary-side electrode of an interdigital electrodeincluded in said first SAW element to a primary-side electrode of aninterdigital electrode included in said second SAW element.

Another object of the present invention is to provide a SAW device,comprising:

a piezoelectric substrate;

first and second reflectors provided on said piezoelectric substratealong a propagation path of a surface acoustic wave excited on saidpiezoelectric substrate; and

a plurality of interdigital electrodes disposed on said piezoelectricsubstrate consecutively from said first reflector to said secondreflector;

each of said plurality of interdigital electrodes including aprimary-side electrode that includes a plurality of mutually parallelelectrode fingers extending in a first direction across said propagationpath of said surface acoustic wave and a secondary-side electrode thatincludes a plurality of mutually parallel electrode fingers extending ina second, opposite direction across said propagation path of saidsurface acoustic wave, said electrode fingers of said primary-sideelectrode and said electrode fingers of said secondary-side electrodebeing disposed, in each of said plurality of interdigital electrodes,alternately along said propagation path and overlapping with apredetermined overlap width when viewed in a direction of saidpropagation path of said surface acoustic wave;

said plurality of interdigital electrodes being cascaded by connecting asecondary-side electrode of an interdigital electrode to asecondary-side electrode of another interdigital electrode.

According to the present invention, it is possible to set the inputimpedance and output impedance of the SAW device as desired, byappropriately setting the overlap of the electrode fingers in the firstSAW element and in the second SAW element or in a first interdigitalelectrode and a second interdigital electrode cascaded to the firstinterdigital electrode, without changing the pitch of the interdigitalelectrodes. As the pitch of the interdigital electrodes is not changed,the frequency characteristic of the SAW filter is not influenced, andonly the input and output impedances are set independently andarbitrarily in the present invention according to the demand of thecircuit design.

As a result of such an arbitrary setting of the input and outputimpedances, a number of such SAW filters can be cascaded successfully,resulting an improved suppression of spurious peaks outside thepass-band. In other words, a SAW filter having a very sharp selectivityis obtained. Further, by cascading a number of SAW filters to form a SAWfilter assembly, it is possible to set the ratio between the inputimpedance and the output impedance of the SAW filter assembly to be avery large value not attainable by a single stage SAW filter.

Another object of the present invention is to provide a SAW device,comprising:

a package body supporting a piezoelectric substrate thereon;

at least one SAW element formed on said piezoelectric substrate;

said SAW element including a plurality of interdigital electrodesdisposed along a propagation path of a surface acoustic wave on saidpiezoelectric substrate, each of said interdigital electrodes includingan input-side interdigital electrode and an output-side interdigitalelectrode;

said input-side interdigital electrode being connected to a first groundpad provided on said package body;

said output-side interdigital electrode being connected to a second,different ground pad provided on said package body.

According to the present invention, the problem of interference betweenthe ground electrode of the input-side interdigital electrode and theground electrode of the output-side interdigital electrode issuccessfully eliminated, and the pass-band characteristics of the SAWdevice is improved substantially.

Another object of the present invention is to provide a double-mode SAWdevice, comprising:

a piezoelectric substrate;

first and second reflectors provided on said piezoelectric substratealong a propagation path of a surface acoustic wave on saidpiezoelectric substrate;

first, second and third interdigital electrodes provided on saidpiezoelectric substrate consecutively from said first reflector to saidsecond reflector;

each of said first through third interdigital electrodes including firstthrough third number of pairs of electrode fingers respectively;

wherein said first number of pairs of electrode fingers for said firstinterdigital electrode is different from said third number of pairs ofelectrode fingers for said third interdigital electrode.

According to the present invention, the symmetricity in the structure ofthe SAW device in the propagating direction of the SAW device isintentionally lost by setting the first and third number of pairs of theelectrode fingers differently. Thereby, the surface acoustic wavereflected by the first reflector and the surface acoustic wave reflectedby the second reflector cancel with each other, and the spurious peaksassociated with such an interference of the reflected surface acousticwave devices is successfully eliminated,

Other objects and further features of the present invention will becomeapparent from the following detailed description when read inconjunction with the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are diagrams respectively showing a construction and anoperational principle of a conventional double-mode SAW filter;

FIG. 2 is a diagram showing a theoretical frequency characteristic ofthe SAW filter of FIGS. 1A and 1B;

FIG. 3 is a diagram showing a construction of a SAW filter according toa first embodiment of the present invention;

FIG. 4 is a diagram showing a theoretical frequency characteristic ofthe SAW filter of FIG. 3 in comparison with a corresponding theoreticalfrequency characteristic of the SAW filter of FIGS. 1A and 1B;

FIG. 5 is a diagram showing an observed frequency characteristic of theSAW filter of FIG. 3;

FIG. 6 is a diagram showing an observed frequency characteristic of SAWfilter of FIGS. 1A and 1B;,

FIG. 7 is a diagram showing a construction of a SAW filter according toa second embodiment of the present invention;

FIG. 8 is a diagram showing a modification of the SAW filter of FIG. 7;

FIG. 9 is a diagram showing a further modification of the SAW filter ofFIG. 7;

FIG. 10 is a diagram showing a frequency characteristic of the SAWfilter of FIG. 9;

FIG. 11 is a diagram showing a construction of a SAW filter according toa third embodiment of the present invention;

FIG. 12 is a diagram showing a construction of a SAW filter according toa fourth embodiment of the present invention;

FIG. 13 is a diagram showing a frequency characteristic of the SAWfilter of FIG. 12;

FIG. 14 is a diagram showing the construction of the SAW filter of FIG.12 including a metal cap in an exploded state;

FIG. 15 is a diagram showing a frequency characteristic of the SAWfilter of FIG. 14;

FIG. 16 is a diagram showing a construction of a SAW filter according toa sixth embodiment of the present invention;

FIG. 17 is a diagram showing a construction of a SAW filter according toa seventh embodiment of the present invention;

FIG. 18 is a diagram showing a modification of the SAW filter of FIG.17;

FIG. 19 is a diagram showing another modification of the SAW filter ofFIG. 17; and

FIG. 20 is a diagram showing a further modification of the SAW filter ofFIG. 17.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIRST EMBODIMENT

First, the principle of the present invention will be described withreference to FIG. 3 showing a SAW filter 11 according to a firstembodiment of the present invention, wherein those parts correspondingto the parts described previously are designated by the same referencenumerals and the description thereof will be omitted.

Referring to FIG. 3, the SAW filter 11 has a double-mode constructionsimilar to the conventional SAW filter of FIG. 1A, except that thenumber of the electrode finger pairs N₁ for the interdigital electrode11A and the number of the electrode finger pairs N₃ for the interdigitalelectrode 11C, and further the number of the electrode finger pairs N₂for the interdigital electrode 11B, are changed from each other(N₁≠N₃≠N₂).

FIG. 4 shows a calculated, theoretical frequency characteristic of theSAW filter 11 of FIG. 3, wherein the continuous line of FIG. 4 indicatesthe result for a conventional case in which the numbers of the electrodefinger pairs N₁, N₂ and N₃ are set respectively to 20, 40 and 20. Itshould be noted that a relationship N₁=N₃ holds in this case. Further,the broken line of FIG. 4 indicates the result for a case in which thenumbers of the electrode finger pairs N₁, N₂ and N₃ are set to 25, 35and 45, respectively. In this case, a relationship N₁≠N₃≠N₂ holds. Thedotted line of FIG. 4 indicates the result for a case in which thenumbers of the electrode finger pairs N₁, N₂ and N₃ are set respectivelyto 20, 40 and 30. In this case, too, the relationship N₁≠N₃≠N₂ holds.

In the calculation of FIG. 4, it should further be noted that a singlecrystal plate of 36° Y-X LiTaO₃ is assumed for the substrate 1, and thecalculation is made for the case in which the interdigital electrodes onthe substrate 1 is formed of Al with a thickness corresponding to 8% thewavelength of the surface acoustic wave excited on the substrate 1.

In the course of investigation including such a theoretical calculationof the frequency characteristic of the SAW filter 11, the inventor ofthe present invention has discovered, as indicated in FIG. 4, that theheight of the spurious peaks outside the pass-band decreasessignificantly and substantially when the numbers N₁ and N₃ of theelectrode finger pairs for the interdigital electrode 11A and 11C areset asymmetric (N₁≠N₃) about the central interdigital electrode 11B.While the reason of such a suppressing of the spurious peaks is notfully understood, it is thought that such an asymmetric construction ofthe SAW filter 11 facilitates cancellation of the surface acoustic wavesexcited by the interdigital electrode 11A and returning to theinterdigital electrode 11B after reflection at the reflector 10A and thesurface acoustic waves excited by the interdigital electrode 11C andreturning to the interdigital electrode 11B after reflection at thereflector 10B.

FIG. 5 shows an actually observed frequency characteristic of the SAWfilter 11 of FIG. 3 for the case in which a 42° Y-X LiTaO₃ singlecrystal plate is used for the piezoelectric substrate 1 and the numbersof the electrode finger pairs N₁, N₂ and N₃ are set to 20, 40 and 30,respectively (N₁:N₂:N₃=20:40:30). In FIG. 5, it should also be notedthat the interdigital electrodes 11A-11C are formed of A1 with athickness corresponding to 6% the wavelength of the surface acousticwave excited on the substrate 1.

FIG. 6, on the other hand, shows an actually observed frequencycharacteristic of the conventional SAW filter of FIG. 1A for the case inwhich a 42° Y-X LiTaO₃ single crystal plate is used for thepiezoelectric substrate 1 similarly to the case of FIG. 5 and thenumbers of the electrode finger pairs N₁, N₂ and N₃ are set respectivelyto 21, 35 and 21 (N₁:N₂:N₃=21:35:21). The interdigital electrodes11A-11C are formed of Al with a thickness corresponding to 6% thewavelength of the surface acoustic wave excited on the substrate 1,similarly to the case of FIG. 5.

Referring to FIGS. 5 and 6, it should be noted that the height of thepredominant spurious peaks appearing at the lower-frequency side of thepass-band in the characteristic of FIG. 6 is reduced substantially inthe characteristic of FIG. 5. Further, the spurious peak appearing onthe higher-frequency side of the pass-band is suppressed substantially.

It should be noted that the SAW filter 11 of the present embodiment isdesigned for use in a GHz band. In a SAW filter for use in such aultra-high frequency band, it should be noted that the thickness of theinterdigital electrode on the piezoelectric substrate 1 is no longerignorable with respect to the wavelength of the excited SAW, and anadded-mass effect of the electrode appears conspicuously. Such anadded-mass effect causes a shift of the optimum cut angle of a LiTaO₃ orLiNbO₃ single-crystal substrate to a higher-angle side. In the case of aLiTaO₃ substrate, the optimum cut angle becomes 40° Y-44° Y, which issubstantially higher than the conventionally used optimum cut angle of36° Y. In the case of a LiNbO₃ substrate, the optimum cut angle falls inthe range between 66° Y and 74° Y when the added-mass effect of theelectrode is considered.

In the SAW filter 11, it should be noted that the added-mass effectappears particularly conspicuous when the thickness of the interdigitalelectrodes 11A-11C is in the range of 5-10% the wavelength of theexcited SAW, provided that LiTaO₃ is used for the substrate 1 and theelectrodes 11A-11C are formed of Al or an Al alloy. When LiNbO₃ is usedfor the substrate 1, on the other hand, the added-mass effect appearsconspicuous when the thickness of the interdigital electrodes 11A-11Cfalls in the range of 4-12% the wavelength of the excited surfaceacoustic wave. In this case, too, use of Al or an Al-alloy is assumedfor the interdigital electrodes 11A-11C.

SECOND EMBODIMENT

Next, a SAW filter circuit device according to a second embodiment ofthe present invention will be described with reference to FIG. 7,wherein those parts described previously are designated by the samereference numerals and the description thereof will be omitted.

Referring to FIG. 7, the SAW filter circuit device of the presentembodiment is constructed on the substrate 1 of 42° Y-X LiTaO₃ singlecrystal plate and includes, in addition to the SAW filter 11, anotherSAW filter 21 that includes reflectors 20A and 20B aligned on the samesubstrate 1 in the X-direction, wherein the SAW filter 20 furtherincludes interdigital electrodes 21A, 21B and 21C disposed consecutivelyfrom the reflector 20A to the reflector 20B. Similarly as before, theSAW filter 11 includes the reflectors 10A and 10B as well as theinterdigital electrodes 11A-11C, all disposed on the same, commonsubstrate 1.

In the construction of FIG. 7, it should be noted that thesecondary-side electrode (11B)₂ forming a part of the interdigitalelectrode 11B is connected to a corresponding primary-side electrode(21B)₁ of the interdigital electrode 21B. Thereby, the SAW filter 11 andthe SAW filter 21 are cascaded. In each of the SAW filters 11 and 21,the foregoing relationship of N₁≠N₂≠N₃ may hold similarly to case of thefirst embodiment. The present embodiment, however, includes also thecase in which the foregoing relationship does not hold.

In the embodiment of FIG. 7, it should be noted that each of theprimary-side electrodes (11A)₁, and (11C)₁, respectively of theinterdigital electrodes 11A and 11C, are connected commonly to an inputelectrode pad. Further, the secondary-side electrodes (11A)₂ and (11C)₂of the interdigital electrodes 11A and 11C as well as the primary sideelectrode (11B)₁, of the interdigital electrode 11B are grounded.Thereby, the SAW filter 11 forms a filter of a so-called dual-inputsingle-output type. On the other hand, secondary-side electrodes (21A)₂and (21C)₂ respectively of the interdigital electrodes 21A and 21C areconnected commonly to an output electrode pad in the SAW filter 21.Further, primary-side electrodes (21A)₁ and (21C)₁ respectively of theinterdigital electrodes 21A and 21C as well as a secondary-sideelectrode (21B)₂ of the interdigital electrode 21B are grounded.Thereby, the SAW filter 21 forms a filter of a single-input dual-outputtype.

In the embodiment of FIG. 7, the electrode fingers overlap with eachother in the SAW filter 11 with an overlap width W₁ when viewed in thetraveling direction of the surface acoustic wave in the SAW filter 11.Similarly, the electrode fingers overlap with each other in the SAWfilter 21 with an overlap width W₂ when viewed in the travelingdirection of the surface acoustic wave in the SAW filter 21, wherein theSAW filters 11 and 21 are formed such that the overlap width W₂ for theSAW filter 21 is different from the overlap width W₁ for the SAW filter11. Thereby, the SAW filter circuit device as a whole shows an inputimpedance equal to the input impedance of the SAW filter 11 and anoutput impedance equal to the output impedance of the SAW filter 21,wherein the input impedance of the SAW filter 11 is determined by theforegoing overlap width W₁, while the output impedance of the SAW filter21 is determined by the overlap width W₂. Thus, by setting the overlapwidths W₁ and W₂ independently, it is possible to design the inputimpedance and the output impedance of the SAW filter circuit deviceindependently and as desired.

FIG. 8 shows a modification of the SAW filter circuit device of FIG. 7,wherein those parts described previously are designated by the samereference numerals and the description thereof will be omitted.

Referring to FIG. 8, it should be noted that the primary-side electrode(11B)₁ of the interdigital electrode 11B is connected to an inputelectrode pad and the secondary-side electrode (11B)₂ is grounded. Onthe other hand, the primary-side electrodes (11A)₁ and (11C)₁ of theinterdigital electrodes 11A and 11C are grounded, and the secondary-sideelectrodes (11A)₂ and (11C)₂ of the interdigital electrodes 11A and 11Care connected respectively to the primary-side electrode (21A)₁ of theinterdigital electrode 21A and the primary-side electrode (21C)₁ of theinterdigital electrode 21C. Thus, the SAW filter 11 of the embodiment ofFIG. 8 has a single-input dual-output construction.

In the SAW filter 21, on the other hand, the secondary electrodes (21A)₂and (21C)₂ of the interdigital electrodes 21A and 21C are grounded, andthe output is obtained at the secondary-side electrode (21B)₂ of theinterdigital electrode 21B. Thus, the SAW filter 21 has a dual-inputsingle-output construction.

In the SAW filter device of FIG. 8, too, it is possible to set the inputimpedance and the output impedance of the SAW filter circuit device asdesired, by setting the overlap width W₁ and the overlap width W₂independently in the SAW filter 11 and the SAW filter 21.

FIG. 9 shows a further modification of the SAW filter circuit device ofFIG. 7, wherein those parts described previously are designated by thesame reference numerals and the description thereof will be omitted.

Referring to FIG. 9, the SAW filter 11 has a dual-input single-outputconstruction similarly to the embodiment of FIG. 7. Further, the SAWfilter 21 has a dual-input single-output construction similarly to theembodiment of FIG. 7. Thus, the primary-side electrodes (11A)₁, and(11C)₁ of the interdigital electrodes 11A and 11C are connected commonlyto an input electrode pad and the secondary-side electrodes (11A)₂ and(11C)₂ of the interdigital electrodes 11A and 11C as well as theprimary-side electrode (11B)₁, of the interdigital electrode 11B aregrounded.

In the SAW filter 21, the primary-side electrodes (21A)₁ and (21C)₁ ofthe interdigital electrodes 21A and 21C are connected commonly to thesecondary-side electrode (11B)₂ of the interdigital electrode 11B, andthe secondary-side electrodes (21A)₂ and (21C)₂ are grounded. Further,the secondary-side electrode (21B)₂ of the interdigital electrode 21B isconnected to an output electrode pad. In other words, the constructionof FIG. 9 includes two dual-input single-output SAW filters 11 and 21 ina cascaded connection.

In the SAW filter circuit device of FIG. 9, it should be noted that theSAW filters 11 and 21 are cascaded such that an impedance matching isestablished between the output side of the SAW filter 11 and the inputside of the SAW filter 21, for minimizing the loss occurring as a resultof such a cascaded connection.

More specifically, it is known that there holds a general relationship

 Z₁:Z₂=Z₃:Z₄

between the SAW filter 11 and the SAW filter 21, where Z₁, and Z₂respectively stand for the input impedance and output impedance of theSAW filter 11, Z₃ and Z₄ respectively stand for the input impedance andoutput impedance of the SAW filter 21.

The present embodiment realizes an impedance matching between the SAWfilters 11 and 21 as represented by a condition

Z₂=Z₃

by setting the overlap widths W₁ and W₂ appropriately.

As a result, there holds a relationship between the impedances Z₁, Z₂,Z₃ and Z₄ as follows:

Z₂=Z₃=(Z₁·Z₄)

In the SAW filter circuit device of FIG. 9, the overlap width W₁ of theSAW filter 11 is set to 60λwhile the overlap width W₂ of the SAW filter21 is set to 35λ, wherein λ represents the wavelength of the surfaceacoustic wave excited on the piezoelectric substrate 1 and has a valueof about 4.3 μm in the present example. Further, there holds thefollowing relationship for the SAW filters 11 and 21 in the SAW filterdevice of FIG. 9:

N₁:N₂:N₃=15:21:15

In this case, the SAW filter 11 has an input impedance of 50Ω, whereinthis value of the input impedance of the SAW filter 11 provides theinput impedance of the cascaded SAW filter circuit device of FIG. 9.Further, the SAW filter 21 thus configured has an output impedance of150Ω, wherein this output impedance of the SAW filter 21 provides theoutput impedance of the cascaded SAW filter circuit device.

In the SAW filter circuit device of FIG. 9 where there exists animpedance matching between the cascaded SAW filters 11 and 21, it ispossible to increase the number of the cascaded stages further, suchthat the output impedance of the SAW filter circuit device becomes verymuch larger than or very much smaller than the input impedance of thesame SAW filter circuit device.

Further, it should be noted that such a cascaded SAW filter circuitdevice, which may include many cascaded SAW filters therein, isextremely effective for suppressing the spurious peaks outside thepass-band and for improving the selectivity of the filter.

FIG. 10 shows the pass-band characteristic of the cascaded SAW filtercircuit device of FIG. 9 for the case in which the input side isterminated by a resistance of 50Ω and the output side is terminated by aresistance of 150Ω.

Referring to FIG. 10, it will be understood that the spurious peaksoutside the pass-band are effectively suppressed by cascading the SAWfilters 11 and 21 as such. In other words, FIG. 10 indicates clearlythat an effect of suppressing spurious peaks similarly to the effectachieved by the SAW filter of the first embodiment, is achieved also inthe present embodiment.

THIRD EMBODIMENT

FIG. 11 shows the construction of a SAW filter according to a thirdembodiment of the present invention, wherein those parts describedpreviously are designated by the same reference numerals and thedescription thereof will be omitted.

In the present embodiment, the input impedance and the output impedanceare changed for a single SAW filter.

Referring to FIG. 11, it should be noted that the primary-side electrode(11B)₁ of the interdigital electrode 11B is connected to a first inputelectrode pad while the secondary-side electrode (11B)₂ of theinterdigital electrode 11B is connected to a second input electrode pad.Thus, the SAW filter of FIG. 11 operates as a differential filter devicewhen different input signals are supplied respectively to the foregoingprimary-side electrode (11B)₁ and the secondary-side electrode (11B)₂.Alternatively, the electrode (11B)₂ may be grounded.

In the SAW filter of FIG. 11, the secondary-side electrode (11A)₂ andthe secondary side electrode (11C)₂ are connected to each other, and theprimary-side electrode (11A)₁ of the interdigital electrode 11A isconnected to a first output electrode pad, the primary-side electrode(11C)₁ of the interdigital electrode 11C is connected to a second outputterminal. Thereby, the interdigital electrode 11A and the interdigitalelectrode 11C are cascaded. The electrode (11A)₁ and the electrode(11C)₁ may be grounded.

In the construction of FIG. 11, it should be noted that the interdigitalelectrodes 11A-11C have a common overlap width W for the electrodefingers. Even in such a construction, the output impedance of the SAWfilter as a whole is provided by a sum of an output impedance Z₁ of theinterdigital electrode 11A and an output impedance Z₃ of theinterdigital electrode 11C. In other words, the construction of FIG. 11allows an adaptation of the output impedance of the SAW filter as awhole with respect to the input impedance, although the degree offreedom of such an adjustment is limited somewhat as compared with theprevious embodiment. In the SAW filter of FIG. 11, the input impedanceis provided by the input impedance Z₂ of the interdigital electrode 11B.

FOURTH EMBODIMENT

FIG. 12 shows a construction of a SAW filter according to a fourthembodiment of the present invention including a package, wherein thoseparts described previously are designated by the same reference numeralsand the description thereof will be omitted.

Referring to FIG. 12, the piezoelectric substrate 1 carrying thereon aSAW filter similar to the SAW filter of FIG. 7 is held on a ceramicpackage body 100, wherein the package body 100 carries thereon groundelectrode pads 101 and 103 at a first side thereof together with aninput electrode pad 102 such that the ground electrode pads 101 and 103are located at both lateral sides of the input electrode pad 102.Similarly, the package body 100 carries thereon ground electrode pads104 and 106 on a second, opposite side thereof together with an outputelectrode pad 105 such that the ground electrode pads 104 and 106 arelocated at both lateral sides of the output electrode pad 105.

In the construction of FIG. 12, the ground electrode of the interdigitalelectrode 11A corresponding to the electrode (11A)₂ of FIG. 7 isconnected to the ground electrode pad 101 on the package body 100 by anAl wire 107. Further, the ground electrode of the interdigital electrode11C corresponding to the electrode (11C)₂ of FIG. 7 is connected to theground electrode pad 103 on the package body 100 by another Al wire 107.Similarly, the ground electrode of the interdigital electrode 11Bcorresponding to the electrode (11B)₁ of FIG. 7 is connected to theforegoing ground electrode 103 by a still another Al wire 107. Further,the output electrodes of the-interdigital electrodes 11A and 11Ccorresponding to the electrodes (11A)₁ and (11C)₁ are connected commonlyto the input electrode pad 102 disposed between the ground electrode pad101 and the ground electrode pad 103 by way of respective Al wires 107.

In the SAW filter 21 formed also on the same piezoelectric substrate 1,it should be noted that the ground electrode of the interdigitalelectrode 21A corresponding to the electrode (21A)₁ of FIG. 7 isconnected to the ground electrode pad 104 on the package body 100 byanother Al wire 107. Further, the ground electrode of the interdigitalelectrode 21C corresponding to the electrode (21C)₁ of FIG. 7 isconnected to the ground electrode pad 106 on the package body 100 bystill another Al wire 107. Further, the ground electrode of theinterdigital electrode 21B corresponding to the electrode (21B)₂ of FIG.7 is connected to the ground electrode pad 104 by another Al wire 107.Further, the output electrodes of the interdigital electrodes 21A and21C corresponding to the electrodes (21A)₂ and (21C)₂ are connectedcommonly to the output electrode pad 105 provided between the foregoingground electrode pads 104 and 106 by means of another Al wire 107.Furthermore, the SAW filter 11 and the SAW filter 21 are cascaded byconnecting the secondary-side electrode (11B)₂ of the interdigitalelectrode 11B to the primary-side electrode (21B)₁ of the interdigitalelectrode 21B.

Generally, electrodes provided on a ceramic package more or less form acapacitive coupling with each other, while the present invention avoidsthe problem associated with such a capacitive coupling of the electrodesby disposing the input-side ground electrode pads 101 and 103 on thefirst edge of the package body 100 and the output-side ground electrodepads 104 and 106 on the second, opposite edge of the package body 100.By disposing the ground electrodes as such, it is possible to avoidinterference between the input-side ground electrode pads and theoutput-side ground electrode pads, and the selectivity of the SAW filteras a whole is improved. In the construction of FIG. 12, it shouldfurther be noted that the ground electrode pads 101 and 103 areseparated and the ground electrode pads 104 and 106 are separated forfurther suppressing of the interference.

FIG. 13 shows the pass-band characteristic of the SAW filter of FIG. 12for the case in which the ground connections of the SAW filters 11 and21 are made both to the input side where the ground electrode pads 101and 103 are provided and the output side where the ground electrode pads104 and 106 are provided.

Referring to FIG. 13 showing characteristic curves A and B, thecharacteristic curve B represents the pass-band characteristic for theSAW filter of FIG. 12 as it is, while the characteristic curve Arepresents the pass-band characteristic of the SAW filter of FIG. 12 forthe case in which the secondary-side electrodes (11C)₂ and (11A)₂ of theinterdigital electrodes 11A and 11C are connected respectively to theground electrode pads 101 and 104 and further to the ground electrodepads 103 and 106 by respective Al wires 107. Similarly, thesecondary-side electrodes (21C)₂ and (21A)₂ of the interdigitalelectrodes 21A and 21C are connected respectively to the groundelectrode pads 101 and 104 and further to the ground electrode pads 103and 106 by respective Al wires 107 in the case of the characteristiccurve A.

As will be seen clearly from FIG. 13, the suppression of spurious peaksoutside the pass-band of the SAW filter is deteriorated in the case ofthe characteristic curve A, indicating the effectiveness of theconstruction of FIG. 12 that provides the characteristic curve B.

FIFTH EMBODIMENT

A SAW filter is used generally in the form of a package in which the SAWfilter is accommodated in a package body. Thus, the package of the SAWfilter also requires an improvement, particularly with respect to ametal protective cap used in the package for protecting the SAW deviceaccommodated therein.

FIG. 14 shows a fifth embodiment of the present invention directed tosuch an improvement of the package, wherein FIG. 14 shows the packagethat accommodates the SAW filter of FIG. 12 in an exploded state. InFIG. 14, those parts described previously are designated by the samereference numerals and the description thereof will be omitted.

Referring to FIG. 14, the package includes a package body correspondingto the package body 100 of FIG. 12, wherein the package body 100 in turnis formed of a base 100A and a holder piece 100B provided on the base100A, wherein the holder piece 100B is formed with a central opening foraccommodating therein a SAW filter which may have a construction of FIG.12, for example. Further, the SAW package includes a spacer member 110provided on the foregoing package body 100, and a metal cap 120 isprovided on the spacer member 110 thus provided on the package body 100for protecting the SAW filter held in the package body 100.

It should be noted that the base 100A of the package body 100 is formedwith chamfered surfaces 100A₁, 100A₂, 100A₃ and 100A₄ at four cornersthereof and a ground electrode 100G is formed on the top surface asindicated in FIG. 14, wherein the ground electrode 100G extends in thedirection of the output-side edge in the form of electrode leads 100Gaand 100Gb. Further, electrodes leads 100 ga and 100 gb extend in adownward direction on the side wall of the base 100A respectively fromthe electrode leads 100Ga and 100Gb. Similarly, electrode leads 100Gcand 100Gd extend from the ground electrode 100G toward the input-sideedge of the base 10A, and electrodes 100 gc and 100 gd not shown in FIG.14 extend respectively from the electrode leads 100Gc and 100Gd on theside wall of the base 100A in the downward direction similarly to theelectrode leads 100 ga and 100 gb.

The base 100A carries thereon the piezoelectric substrate 1 of the SAWfilter, and the holder piece 100B is mounted upon the base 100A as notedbefore, such that the SAW filter on the base 100A is accommodated in thecentral opening formed in the holder piece 100B. Thereby, thepiezoelectric substrate 1 is adhered to a part of the ground electrode100G exposed by the central opening of the holder piece 100B.

The holder piece 100B is formed with chamfered surfaces 100B₁-100B₄ atfour corners thereof respectively corresponding to the chamferedsurfaces 100Al₁-100A₄, and the electrode pads 101-103 are formed on thetop surface of the holder piece 100B along an input-side edge asindicated in FIG. 14. Similarly, the electrode pads 104-106 are formedon the top surface of the holder piece 100B along an output-side edge.

Further, electrode leads 104 a, 105 a and 106 a extend on the side wallof the holder piece 100B respectively from the electrodes 104-106 in thedownward direction, wherein the electrode lead 104 a is connected to theelectrode lead 100 ga on the side wall of the base 100A. Similarly, theelectrode lead 106 a is connected to the electrode lead 100 gb, and theelectrode lead 105 a is connected to an electrode lead 100 o provided onthe side wall of the base 100A between the electrode leads 100 ga and100 gb. Similar electrode leads are formed also on the input-side of theholder piece 100B in correspondence to the electrode pads 101-103.

The spacer member 110 has a ring-shaped form and exposes a part of theelectrode pads 101-106 as well as a part of the piezoelectric substrate1, wherein it will be noted from FIG. 14 that the spacer member 110includes chamfered surfaces 110 ₁-110 ₄ respectively corresponding tothe chamfered surfaces 100B₁-100B₄ of the holder piece 100B. The spacermember 100 carries thereon a ground electrode 110A, and the metal cap120 is brazed upon the ground electrode 110A thus formed on the spacermember 110.

It should be noted that the ground electrode 110A includes a ground leadextending on the chamfered surface 110 ₁ in the downward direction,wherein the ground lead is connected to a corresponding ground lead 104a extending from the ground electrode pad 104 on the holder piece 100Bto the chamfered surface 100B₁, upon mounting of the spacer member 110on the holder piece 100B. In other words, the metal cap 120 is connectedto the ground electrode pad 104 alone and not to other ground electrodepads 101, 103 or 106. By configuring the package structure as such, itis possible to avoid the problem of deterioration of the SAW filterpass-band characteristic caused by the interference of ground electrodepads explained with reference to FIG. 13.

FIG. 15 shows the pass-band characteristic of the SAW filter of FIG. 14.

Referring to FIG. 15 showing characteristic curves A and B, it should benoted that the characteristic curve B indicates the pass-bandcharacteristic of the SAW filter of FIG. 14, while the characteristiccurve A indicates the pass-band characteristic of the SAW filter inwhich the metal cap 120 is grounded at all of the four corners thereofin the construction of FIG. 14.

As will be seen clearly in FIG. 15, the spurious level outside thepass-band increases substantially in the case the metal cap 120 isgrounded at all the four corners thereof as compared with the case ofFIG. 14 in which the metal cap 120 is grounded only at one cornerthereof. The result of FIG. 15 clearly demonstrates the existence ofinterference between different ground electrode pads acting over themetal cap 120.

SIXTH EMBODIMENT

FIG. 16 shows the construction of a SAW filter according to a sixthembodiment of the present invention including the package body, whereinthe SAW filter of FIG. 16 is a modification of the SAW filter of FIG.12. Thus, the parts of the SAW filter of FIG. 16 corresponding to thoseof FIG. 12 are designated by the same reference numerals and thedescription thereof will be omitted.

Referring to FIG. 16, the piezoelectric substrate 11 held on the packagebody 100 carries thereon only the SAW filter 11 or 21. Thereby, theinterdigital electrodes 11A and 11C of the output-side are grounded atthe output-side ground electrode pads 104 and 106 respectively. Further,the interdigital electrode 11B of the input-side is grounded at theinput-side ground electrode pad 101. In the SAW filter of FIG. 16, itshould be noted that an input signal is supplied also to the groundelectrode pad 101. Thereby, the SAW filter of FIG. 16 operates as adifferential type filter.

In the SAW filter of FIG. 16 the interaction of the input-side groundpad and the output-side ground pad via the capacitive coupling issuccessfully and effectively eliminated, and an excellent pass-bandcharacteristic similar to the one shown in FIG. 12 is obtained.

SEVENTH EMBODIMENT

FIG. 17 shows the construction of a SAW filter according to a seventhembodiment of the present invention, wherein those parts describedpreviously with reference to preceding drawings are designated by thesame reference numerals and the description thereof will be omitted.

Similarly to the SAW filter of FIG. 16, the SAW filter of the presentembodiment can be used also as a differential type filter, by supplyingan input signal not only to the input electrode pad but also to theground electrode pad. Thus, the SAW filter of FIG. 16 has thesecondary-side electrodes (11A)₂ and (11C)₂ of the interdigitalelectrodes 11A and 11C not grounded but supplied with a second inputsignal IN₂ different from a first input signal IN₁ which is supplied tothe primary-side electrodes (11A)₁ and (11C)₁ of the interdigitalelectrodes 11A and 11C. Thereby, it should be noted that primary-sideelectrode (11B)₁ of the interdigital electrode 11B is not grounded butproduces an output signal OUT₂ that is different from an output signalOUT₁ obtained at the secondary-side electrode (11B)₂ of the interdigitalelectrode 11B.

In the construction of FIG. 17, it should be noted that the relationship

N₁≠N₂≠N₃

holds between the numbers N₁, N₂ and N₃ of the electrode finger pairs,similarly to the embodiment of FIG. 3.

FIG. 18 shows a modification of the embodiment of FIG. 17 in which theSAW filter is operated in a differential mode in FIG. 18, wherein thoseparts corresponding to the parts described previously are designated bythe same reference numerals and the description thereof will be omitted.

Referring to FIG. 18, the secondary-side electrodes (11A)₂ and (11C)₂ ofthe interdigital electrodes 11A and 11C are supplied commonly with aninput signal IN₂ different from an input signal IN₁ supplied to theprimary-side electrodes (11A)₁ and (11C)₁. Further, an output signalOUT₂ different from an output signal OUT₁ obtained from thesecondary-side electrodes (21A)₂ and (21C)₂ are obtained from theprimary-side electrode (21A)₁ of the interdigital electrode 21A and theprimary-side electrode (21C)₁. Similarly to the case of FIG. 7, itshould be noted that the SAW filter of FIG. 18 has a construction inwhich the overlap width W₁ for the SAW filter 11 is different from theoverlap width W₂ for the SAW filter 21.

FIGS. 19 and 20 show respectively an example of modifying the SAWfilters of FIGS. 8 and 9 to form differential mode SAW filters. In theseexamples, too, an input signal IN₂ different from the input signal IN₁used in the example of FIG. 8 or FIG. 9 is supplied to the groundelectrode, and an output signal OUT₂ different from the output signalOUT₁ is obtained at the ground electrode. As the construction of FIGS.19 and 20 is obvious from the description heretofore, furtherdescription thereof will be omitted. In the construction of FIGS. 19 and20, it should be noted that the differential construction may beprovided only to one of the input-side and the output-side.

In each of the embodiments described heretofore, it is preferable to usea Y-cut single crystal plate of LiTaO₃ or LiNbo₃, with a cut angle of40° Y-44° Y when LiTaO₃ is used or with a cut angle of 66° Y-74° Y whenLiNbO₃ is used. When LiTaO₃ is used for the piezoelectric substrate 1,it is preferable to set the thickness of the interdigital electrodes onthe substrate 1 to have a thickness of 5-10% the wavelength of thesurface acoustic wave excited on the piezoelectric substrate 1, providedthat the interdigital electrodes are formed of Al or an Al-alloy. Whenthe piezoelectric substrate 1 is formed of LiNbO₃, on the other hand, itis preferable to form the interdigital electrodes with a thicknesscorresponding to 4-12% the wavelength of the surface acoustic waveexcited on the piezoelectric substrate 1.

Further, the present invention is not limited to the embodimentsdescribed heretofore, but various variations and modifications may bemade without departing from the scope of the invention.

What is claimed is:
 1. A surface-acoustic-wave device, comprising: apackage body supporting a piezoelectric substrate thereon; at least onesurface-acoustic-wave element formed on the piezoelectric substrate,each of said surface-acoustic-wave elements including a plurality ofinterdigital electrodes disposed along a propagation path of a surfaceacoustic wave on the piezoelectric substrate, each of said plurality ofinterdigital electrodes including an input-side interdigital electrodeand an output-side interdigital electrode, the input-side interdigitalelectrode being connected to a first ground pad provided on said packagebody and the output-side interdigital electrode being connected to asecond ground pad provided on said package body, wherein saidsurface-acoustic-wave device forms a double-mode type filter; and aground electrode formed on said package body where said piezoelectricsubstrate is supported, said ground electrode connecting said firstground pad to said second ground pad, wherein the surface-acoustic-wavedevice further includes a conductive cap protecting the piezoelectricsubstrate, said conductive cap being electrically connected to saidground electrode on said package body.
 2. A surface-acoustic-wave deviceas claimed in claim 1, further comprising: an input electrode padprovided on a first side of said package body; an output electrode padprovided on a second side of said package body, wherein the first groundpad of a first stage surface-acoustic-wave element is provided on thefirst side of the package body and the second ground pad of a finalstage surface-acoustic-wave element is provided on the second side ofsaid package body.
 3. A surface-acoustic-wave device, comprising: apackage body supporting a piezoelectric substrate thereon; at least onesurface-acoustic-wave element formed on the piezoelectric substrate,each of said surface-acoustic-wave elements including a plurality ofinterdigital electrodes disposed along a propagation path of a surfaceacoustic wave on the piezoelectric substrate, each of said plurality ofinterdigital electrodes including an input-side interdigital electrodeand an output-side interdigital electrode, the input-side interdigitalelectrode being connected to a first ground pad provided on said packagebody and the output-side interdigital electrode being connected to asecond ground pad provided on said package body, wherein said surfaceacoustic-wave device forms a double-mode type filter; and a groundelectrode formed on said package body where said piezoelectric substrateis supported, said ground electrode connecting said first ground pad tosaid second ground pad, wherein the surface-acoustic-wave device furtherincludes a conductive cap protecting the piezoelectric substrate,wherein the conductive cap is electrically connected to either the firstor second ground pad.